|
Wafer Specifications
|
| Diameter |
100 ± 0.5 |
mm |
| Hall Mobility |
>2500 |
cm2/v-sec
|
| Resistivity |
>1x107 |
ohm-cm |
| Etch Pit Density |
<4x104
|
cm-2 |
| Orientation
|
(100) ± 0.1* |
|
| Thickness |
600 ± 20 |
mm |
| TTV |
<3 |
mm |
| Warp |
<5 |
mm |
| Major Flat Direction |
[0 ] |
|
| Minor Flat Direction |
[0
1] |
|
| Major Flat Length |
32 ± 2
|
mm |
| Minor Flat Length |
18 ± 2 |
mm |
| The wafers are supplied either single side or double side polished. All wafers are chemically etched prior to inspection and
packaging. |
 |
|
